Podzespoły SP3422-04UTG - transil 4-kanałowy
Firma Littelfuse dodała do oferty 4-kanałowy transil o małej pojemności wewnętrznej. Jest on przeznaczony do ochrony przed przepięciem linii sygnałowych.
Układ SP3422-04UTG to transil 4-kanałowy w obudowie DFN o wymiarach 1,0 mm×0,6 mm×0,45 mm. Nadaje się do ochrony linii sygnałowych i danych interfejsów komunikacyjnych USB 3.0, USB 2.0 i IEEE 1394, MIPI, DisplayPort.
Zabezpiecza przed wyładowaniami ESD do 22 kV, co przekracza wymagania określone w normie IEC 61000-4-2. Jest odporny na impulsy 5/50 ns do 40 A oraz tp=8/20 µs do 2 A powstające w wyniku wyładowań atmosferycznych (zgodnie z normą IEC 61000-4-4, IEC 61000-4-5).
Układ SP3422-04UTG zawiera 4 wewnętrzne transile rail-to-rail o typowej pojemności 2 pF przy 3 GHz oraz diodę Zenera chroniącą przed wyładowaniami ESD. Ma przy tym mały prąd upływu wynoszący 20 nA przy napięciu 5 V. Zakres temperatury otoczenia rozciąga się od -40 do +125°C.
czwartek, 24 maja 2018 20:04
IBM announced new recruitment in France before a meeting between President Emmanuel Macron and the bosses of IBM and Microsoft. IBM will hire about 1,400 people in France over the next two years in the fields of blockchain, cloud computing and internet of things, the company said. These jobs come on top of the already-announced 400 new hirings IBM said it will make in the field of artificial intelligence in France. Microsoft’s boss Satya Nadella and his counterpart at IBM, Ginni Rometty, are each scheduled to have one-on-one meetings with Macron later on Wednesday, before so-called "Tech for Good" workshops with them and heads of other tech companies Uber and Facebook. więcej na: www.reuters.com
czwartek, 24 maja 2018 17:57
Apple's new chip for the next-gen iPhones is smaller than its predecessors - it's also already in production. Cupertino's manufacturing partner, TSMC, has reportedly started mass producing the 7-nanometer chip that was created to be faster and more efficient than the 10-nanometer design (used for the iPhone 8 and X) it's replacing. It will enable faster app loading times and longer battery life, which are qualities that can convince buyers to get an iPhone instead of a Galaxy S or any other device from its competitors. Considering the slowdown in the global smartphone industry's growth, phonemakers need to conjure up ways to persuade people to buy a new device. więcej na: www.engadget.com
czwartek, 24 maja 2018 16:00
Toshiba Memory announced recently it had decided to start constructing a new fab for BiCS FLASH, the company's proprietary 3D flash memory, in Kitakami in July 2018. TMC selected Kitakami City as the next location to expand its operations in September 2017, and has started preparations for construction of the new fab. Demand for 3D flash memory has been rising on robust demand for enterprise SSDs for datacenters and servers. The new fab will be completed in 2019, according to the company. It will introduce an advanced production system that uses AI to boost productivity. Decisions on the new fab's equipment investment, production capacity and production plan will reflect market trends. więcej na: www.digitimes.com
czwartek, 24 maja 2018 13:54
Samsung Electronics laid out plans to bring to mass production in 2021 the architectural successor to FinFETS, gate-all-around (GAA) transistors, at the 3nm node. The South Korean giant also reaffirmed plans to begin 7nm production using extreme ultraviolet lithography in the second half of this year at its annual foundry technology forum. GAA technology has been under development since the early 2000s by Samsung and other firms. GAA transistors are field-effect transistors that feature a gate on all four sides of the channel to overcome the physical scaling and performance limitations of FinFETs, including supply voltage. Samsung's proprietary GAA technology, known as multi-bridge-channel FET, has been in development since 2002, according to Ryan Sanghyun Lee, vice president of market for Samsung Foundry. więcej na: www.eetimes.com
czwartek, 24 maja 2018 11:55
GlobalFoundries announced that its 22nm FD-SOI (22FDX) technology platform has been certified to AEC-Q100 Grade 2 for production. As a part of the AEC-Q100 certification, devices must successfully withstand reliability stress tests for an extended period of time, over a wide temperature range in order to achieve Grade 2 certification. The qualification of GF’s 22FDX process exemplifies the company’s commitment to providing high-performance, high-quality technology solutions for the automotive industry. “FD-SOI has advantages for companies who are looking for real-time trade-offs in power, performance and cost," said Dan Hutcheson, CEO and Chairman of VLSI Research. więcej na: www.globalfoundries.com
czwartek, 24 maja 2018 10:01
Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i As/P MOCVD System for production of its advanced semiconductor components which address the 3D sensing, high-speed fiber-optic communications and laser-based materials processing end-markets. Lumentum, headquartered in Milpitas, Calif., is a manufacturer of innovative optical and photonics products. “The global communications, industrial and consumer electronics markets that our proprietary semiconductor lasers address are growing rapidly,” said Susan Wang, vice president of manufacturing at Lumentum. The K475i system incorporates proprietary TurboDisc and Uniform FlowFlange MOCVD technologies. więcej na: www.veeco.com