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Mobilna Elektronika Praktyczna

Z kraju  Fideltronik: LAB na AGH 

 

Firma Fideltronik nawiązała współpracę z Akademią Górniczo-Hutniczą w Krakowie, w ramach której w Centrum Energetyki AGH powstaje Laboratorium Fideltronik.

W nowym centrum zespoły studentów będą mogły realizować projekty z obszaru elektroniki, automatyki i robotyki, sztucznej inteligencji oraz IoT. Niewielka odległość od uczelnianego kampusu pozwoli studentom na pracę w elastycznym zakresie godzin, uwzględniającym ich plan zajęć. Laboratorium ma być również okazją do poznania firmy Fideltronik, jeszcze w trakcie studiów.

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niedziela, 25 czerwca 2017 19:50

IOC and Intel announce worldwide TOP partnership through 2024

The International Olympic Committee and Intel have announced a long-term technology partnership at an official signing ceremony in New York with IOC President Thomas Bach and Intel CEO, Brian Krzanich. Intel will join The Olympic Partner worldwide sponsorship program, becoming a Worldwide TOP Partner through 2024. The Olympic Games offer an unparalleled global platform to showcase what Intel technology can do to transform the future of sports. więcej na: www.digitimes.com

niedziela, 25 czerwca 2017 16:06

Toshiba asks regulators for extension on financial filing

Toshiba Corp said it has asked regulators for an extension for filing its annual financial statement by over a month as it has not been able to obtain approval from its auditor. The industrial conglomerate was aiming to file the financial report by the legally specified deadline of June 30, but now said it wants an extension until Aug. 10 due partly to a prolonged accounting investigation involving its now bankrupt Westinghouse nuclear unit. The Japanese company said it expects to complete all necessary accounting procedures for the annual statement by the end of July. więcej na: www.reuters.com

niedziela, 25 czerwca 2017 11:56

Samsung starts mass production of Exynos i T200 IoT chipset

Samsung is manufacturing smartphone chipsets since it launched the Galaxy S series back in 2010. Now with smart devices gaining more and more traction, the company is ready to expand and it announced it started mass production of the Exynos i T200, a solution for the Internet of Things. The chipset is built on a 28-nanometer High-K Metal Gate (HKMG) process and features Wi-Fi connectivity. It utilizes a Cortex-R4 processor and an Cortex-M0+ co-processor, enabling devices to operate without the need for an extra controller. więcej na: www.gsmarena.com

niedziela, 25 czerwca 2017 07:56

STMicroelectronics prices a US$1.5 billion dual-tranche offering of New Convertible Bonds

STMicroelectronics N.V. announces the pricing of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of STMicroelectronics. The New Convertible Bonds will be issued in two tranches, one of US$750 million with a maturity of 5 years and one of US$750 million with a maturity of 7 years. The terms of the New Convertible Bonds are expected to contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash, new Shares and treasury Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. więcej na: globenewswire.com

sobota, 24 czerwca 2017 20:04

Tesla moves a step closer to building electric cars in China

Tesla Inc took a step closer toward establishing an electric vehicle manufacturing plant in China with its announcement on Thursday that it is in exploratory talks with the Shanghai municipal government. Tesla has said it wants to build electric cars in China to avoid a 25-percent tariff on imported vehicles. The company did not provide a timeline for setting up a China plant, but said it expects to "more clearly define" its China production plans by the end of the year. Tesla shares closed up 1.7 percent at $382.61 in Thursday trading. więcej na: www.reuters.com

sobota, 24 czerwca 2017 15:59

New Vivo phone may have an embedded fingerprint sensor, teased for next week

After the VIVO V5S was unveiled in April with a 20MP selfie camera, we’re expecting the next phone will be just as impressive. We hope to see the next model from the company soon as a new phone is being teased to be introduced at the Mobile World Congress in Shanghai. The second MWC event for this year is said to be the launching pad for the new Vivo Android-powered device. Rumor has it the phone will feature a fingerprint sensor embedded in the display. A teaser was recently sighted online, telling us that next phone can “Unlock the future”. The image looks like a fingerprint so we’re assuming the phone will have an in-screen fingerprint sensor. więcej na: androidcommunity.com

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