wersja mobilna | kontakt z nami

Mobilna Elektronika Praktyczna

Podzespoły  ISL3333xE i ISL3335x - transceivery RS-485/RS-232 

 

Układy ISL3333xE i ISL3335x to transceivery RS-485/RS-232 o znamionowym napięciu zasilania, odpowiednio: 3,3 V i 5 V. Co ciekawe i unikatowe, układy mają wbudowane dwa transceivery: podwójny RS-232 (2×Tx, 2×Rx) i pojedynczy RS-485/RS-422.

Ta cecha pozwala na zastąpienie w aplikacji dwóch układów przez jeden, oferowany w takiej samej cenie, jak pojedynczy układ transceivera. Przetwornica wytwarzająca napięcie dla interfejsu RS-232 pracuje w oparciu o pompę ładunku, dzięki czemu do poprawnej pracy są wymagane jedynie 4 kondensatory o pojemności 100 nF.

Układy są zabezpieczone przed wyładowaniami ESD do ±15 kV na liniach interfejsowych. Szybkość transmisji RS-485 sięga 20 Mb/s, natomiast RS-232 400 kb/s (ISL33334, ISL33337) lub 650 kb/s (ISL22254, ISL33357).

Dla ułatwienia aplikacji, układy mają wyprowadzenia rozmieszczone w sposób ułatwiający projektowanie płytki drukowanej, nazywany przez producenta flow through.

Typ VCC Rodzaj obudowy Prędkość RS-485 Prędkość RS-232
ISL33354E 5 V SSOP-28 20 Mb/s 650 kbps
ISL33357E QFN-40
ISL33334E 3,3 V SSOP-28 400 kbps
ISL33337E QFN-40
Więcej na www.intersil.com

Pozostałe artykuły

Zobacz wszystkie

Newsy 24h

piątek, 18 sierpnia 2017 19:59

Ericsson sues smartphone maker Wiko over patent infringement

Ericsson is suing French-Chinese smartphone maker Wiko in two German regional courts over patent infringements. Ericsson said Wiko had infringed its rights for several years without any licence or compensation, despite negotiations since 2013. Wiko, which has its head office in France but is majority-owned by Chinese technology group Tinno Mobile, was not immediately available for comment. Ericsson said it was suing the company in the courts of Duesseldorf and Mannheim for infringement of patents essential for 2G, 3G and 4G cellular technology, as well as implementation patents. więcej na: www.reuters.com

piątek, 18 sierpnia 2017 18:02

Broadcom announces availability of industry’s first complete ecosystem of 802.11ax solutions

Broadcom Limited continues its historic leadership in Wi-Fi by launching Max WiFi, the industry’s first family of connectivity solutions using the next Wi-Fi standard, 802.11ax. The Max WiFi chips enable up to four times faster download speeds, six times faster upload speeds, four times better coverage, and seven times better battery life than similar Wi-Fi solutions on the market today that use 802.11ac. The chips released today are designed to kick-start an ecosystem of Wi-Fi routers, residential gateways, enterprise access points, and client devices that deliver next generation Wi-Fi. więcej na: www.broadcom.com

piątek, 18 sierpnia 2017 15:58

Prashanth Mahendra-Rajah to join Analog Devices as Senior Vice President

Analog Devices, Inc. announced that Prashanth Mahendra-Rajah will join the Company on September 28, 2017 as Senior Vice President, Finance and Chief Financial Officer. Reporting to CEO Vincent Roche, Mr. Mahendra-Rajah will oversee ADI’s global finance organization, with responsibility for financial management, reporting, controls, planning, and strategy. Mr. Mahendra-Rajah currently serves as Chief Financial Officer of WABCO Holdings Inc., a $3B global supplier of commercial vehicle technologies, a position he has held since June 2014. więcej na: www.analog.com

piątek, 18 sierpnia 2017 14:00

PC DRAM contract price rose by over 10% sequentially in Q2

The global DRAM revenue reached a new historical high in the second quarter of 2017, reports DRAMeXchange, a division of TrendForce. Nevertheless, the global ASPs of PC and server DRAM products rose by more than 10% sequentially in the second quarter, while the global ASP of mobile DRAM products showed a less than 5% gain. The smaller price increase for mobile DRAM was due to Chinese smartphone brands lowering than annual shipment targets. “The DRAM market benefitted from the upswing in ASPs and continuing progress in suppliers’ technology migrations,” said Avril Wu. więcej na: en.ctimes.com.tw

piątek, 18 sierpnia 2017 11:55

Applied Materials jumps 4% on FYQ3 Beat, higher Q4 view

Shares of Applied Materials jumped 4% in late trading after the company beat quarterly revenue and profit expectations and easily forecast this quarter's results higher. Strength in tools to make DRAM propelled the year-over-year gain in its semiconductor division. Chip equipment titan Applied Materials this afternoon reportedfiscal Q3 revenue and profit that topped analysts' expectations, and forecast this quarter's revenue and profit comfortably above consensus, sending its shares higher in late trading. Revenue in the three months ended in July rose 33%, year over year, to $3.74 billion, yielding EPS of 86 cents. więcej na: www.barrons.com

piątek, 18 sierpnia 2017 10:08

Wisconsin bill giving $3 billion incentives to Foxconn advances

Wisconsin's Republican-controlled state Assembly voted 59-30 to approve a bill that paves the way for a $3 billion incentives package for a proposed liquid-crystal display plant by Taiwan's Foxconn. The plan still needs to be approved by the joint finance committee, which has members from both the Assembly and the state Senate, as well as the Senate before it can go to the governor.  Foxconn, an electronics manufacturer formally known as Hon Hai Precision Industry Co Ltd, hopes to open a $10 billion plant in 2020 at a 1,000-acre site in southeastern Wisconsin. więcej na: www.reuters.com

Elektronika Praktyczna

Sierpień 2017

PrenumerataePrenumerataKup w kiosku wysyłkowym

Elektronika Praktyczna Plus

lipiec - grudzień 2012

Kup w kiosku wysyłkowym