Sprzęt Komputer jednopłytkowy CoM68
Firma Glyn Polska wprowadziła do sprzedaży miniaturowy komputer jednopłytkowy TXA5 produkowany przez Karo Electronics. Ma on formę pojedynczego modułu SODIMM o wymiarach 68 mm×26 mm.
Jednostką centralną jest procesor Atmel SAMA5D4 Cortex-A5 pracujący z częstotliwością zegarową 528 MHz (wydajność 1,57 DMIPS/MHz). Moduł jest przeznaczony do zastosowania w aplikacjach wymagających małego poboru prądu napisanych dla systemu Linux. Ważniejsze parametry:
Komputer TXA5 może być zasilany napięciem 3,1...5,5 V. Jest produkowany w wariantach na zakres temperatury -40...+85°C lub -25...+85°C.
wtorek, 28 marca 2017 19:54
World-leading chipmaker TSMC is reportedly gearing up to start mass production on "A11" chips for its key client Apple Inc. next month, with the goal of producing 100 million chips by year-end. Citing sources from TSMC's supply chain, the Chinese-language Economic Daily News said Apple had demanded the firm produce at least 50 million chips by July, adding that the chipmaker's record-breaking production goals could reflect Apple's confidence in the sales performance of their 10th-anniversary iPhone. więcej na: www.chinapost.com.tw
wtorek, 28 marca 2017 18:04
Toshiba Corp wants its U.S nuclear unit to file for Chapter 11 protection from creditors as early as Tuesday, according to a source with direct knowledge of the matter, seeking a quick ringfencing of losses before the Japanese parent's financial year ends. While a Westinghouse bankruptcy filing would help limit future losses for Toshiba, it still falls far short of drawing a line under its problems. Any filing would trigger complex negotiations between Toshiba, the nuclear unit and creditors, and could embroil the U.S and Japanese governments given the scale of the collapse and U.S. state loan guarantees for new reactors. więcej na: www.reuters.com
wtorek, 28 marca 2017 15:50
Intel officially launched their first Optane product, the SSD DC P4800X enterprise drive. The Intel Optane Memory SSD uses one or two single-die packages of 3D XPoint non-volatile memory to provide capacities of 16GB or 32GB. The controller gets away with a much smaller package than most SSDs since it only supports two PCIe 3.0 lanes and does not have an external DRAM interface. Because only two PCIe lanes are used by the drive, it is keyed to support M.2 type B and M slots. więcej na: www.anandtech.com
wtorek, 28 marca 2017 14:09
HTC achieved strong results in China and the US with its HTC Vive VR HMD device in the past two years, and in the second quarter, HTC is planning to launch the Vive in Thailand, according to vice president, Raymond Pao. HTC launched its VR businesses in Japan, South Korea, Taiwan, Singapore and Australia in 2016 and is looking to expand into countries in Southeast Asia such as Thailand, Pao noted. Pao pointed out that Thailand's surging consumption of gaming-related applications, increasing population, and rising number of content developers are all factors that prompted HTC to enter the market. więcej na: www.digitimes.com
wtorek, 28 marca 2017 11:53
Imec is granting its Lifetime of Innovation Award to Dr. Kinam Kim, President and General Manager of Semiconductor Business at Samsung Electronics. The selection recognizes Dr. Kim’s leadership and strategic vision, as well as his undeniable impact in the semiconductor industries. “Dr. Kim has been a driving force at Samsung for more than 30 years, and the beacon the industry has used to navigate towards further innovations and technological breakthroughs in memory and computing”, states Luc Van den hove, president and CEO of imec. więcej na: www.imec-int.com
wtorek, 28 marca 2017 10:03
Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage GaN technology is now the industry’s first GaN solution to earn automotive qualification - having passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors. Transphorm’s automotive GaN FET, the TPH3205WSBQA, offers an on-resistance of 49 milliOhms in an industry standard TO-247 package. The part initially targets on-board charger and DC to DC systems for plug-in hybrid electric vehicles and battery electric vehicles. więcej na: www.transphormusa.com